发明名称 Pinned photodiode fabricated with shallow trench isolation
摘要 A method and system is disclosed for reducing or eliminating leakage between a pinned photodiode and shallow trench isolation structure fabricated therewith while optimizing the sensitivity of the photodiode. Provided is a system with an N+ region implanted in a P-type substrate; a P-type well separating the N+ region from the shallow trench isolation (STI) structure; and at least a P+ region over the N+ region, and overlapping at least part of the P-type well and a substrate portion between the N+ region and P-type well. The space between the N+ region and a damaged region adjacent the STI is greater than the distance that the depletion region between the N+ region and the P-type well, expands. The junctions of the various features are optimized to maximize a photosensitive response for the wavelength of the absorbed light as well as reducing or eliminating electrical leakage.
申请公布号 US7348651(B2) 申请公布日期 2008.03.25
申请号 US20040007935 申请日期 2004.12.09
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 YAUNG DUN-NIAN
分类号 H01L31/103 主分类号 H01L31/103
代理机构 代理人
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