发明名称 Low capacitance wiring layout
摘要 Integrated circuits having multi-level wiring layouts designed to inhibit the capacitive-resistance effect, and a method for fabricating such integrated circuits, is described. The integrated circuits have at least two planes of wiring adjacent to each other and extending in the same direction. One embodiment may further include a larger than normal insulator material between planes of wiring extending in one direction and at least one plane of wiring extending in a second direction transverse to the first direction. Each of the wiring channels in a wiring plane may be offset relative to a respective wiring channel in the next adjacent wiring plane which extends in the same direction.
申请公布号 US7348674(B2) 申请公布日期 2008.03.25
申请号 US20050116181 申请日期 2005.04.28
申请人 MICRON TECHNOLOGY, INC. 发明人 FARRAR PAUL A.
分类号 H01L21/4763;H01L23/48;H01L23/52;H01L23/522;H01L23/528;H01L29/40;H01L29/74;H01R12/04;H05K1/11 主分类号 H01L21/4763
代理机构 代理人
主权项
地址