| 摘要 |
A first ceramic substrate includes a substrate ( 2 ) and a glaze layer ( 3 ), wherein the glaze layer has a surface having an Ra of 0.02 mum or less and a Ry of 0.25 mum or less. A second ceramic substrate is formed by subjecting a glass layer ( 24 ) formed on a surface of a substrate ( 2 ) to heating-and-pressurizing treatment, thereby forming a glaze layer ( 3 ) on the substrate ( 2 ), and planarization-polishing the surface of the glaze layer. A third ceramic substrate includes a substrate ( 2 ), a glaze layer ( 3 ) containing substantially no pores formed on the substrate ( 2 ) and the surface thereof being planarization-polished, and a wiring pattern ( 21 ), wherein at least one first end of the wiring pattern is exposed to the glaze layer ( 3 ) surface of the substrate ( 1 ), and at least one second end is exposed to another surface of the substrate ( 1 ).
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