| 摘要 |
An automatic PCB(Printed Circuit Board) cleaning and chip molding device is provided to reduce a time for forming a vacuum by transferring non-stacked circuit boards respectively and reducing a volume of a vacuum chamber for plasma cleaning, thereby reducing an entire manufacturing time. An automatic PCB cleaning and chip molding device includes a first transfer unit, a cleaning unit, a second transfer unit, and a molding unit(61). The first transfer unit transfers a substrate(11) supplied from the outside one by one. The cleaning unit is installed adjacently to the first transfer unit and receives and cleans the substrate transferred through the first transfer unit. The second transfer unit pulls out the substrate of which cleaning is finished by the cleaning unit to transfer the substrate. The molding unit receives the substrate transferred through the second transfer unit inside and seals a molding region of the substrate with protective resin.
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