| 发明名称 |
Head assembly, disk unit, and bonding method and apparatus |
| 摘要 |
A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.
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| 申请公布号 |
US7347347(B2) |
申请公布日期 |
2008.03.25 |
| 申请号 |
US20040972440 |
申请日期 |
2004.10.26 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
KIRA HIDEHIKO;BABA SHUNJI;KAINUMA NORIO;OKADA TORU;YAMAKAMI TAKATOYO;SASAKI YASUNORI;KOMIYAMA TAKESHI;KOBAE KENJI;KOBAYASHI HIROSHI |
| 分类号 |
B23K1/06;B23K37/00;G11B5/48;H01L21/56;H01L21/60;H01L21/68;H01L23/31;H01L29/06 |
主分类号 |
B23K1/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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