METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

A method for manufacturing a semiconductor package is provided to prevent a wafer warpage and to improve contact of solder balls. A substrate(100) having front and rear planes(100f,100b) is provided. A connection terminal is attached to the front plane of the substrate. At this time, plural solder balls are attached to the front plane of the substrate. Sealing materials(140) are then formed on the substrate to expose a part of the connection terminal. By partially removing the rear plane of the substrate, the thickness of the substrate is reduced. The substrate is separated into individual chips.