METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A method for manufacturing a semiconductor device is provided to achieve the reduction in size and increase in density of the semiconductor device, because a wiring structure can be formed on an overlying layer of a radio communication module including elements higher than a mounting surface of an electrical component. A method for manufacturing a semiconductor device comprises the steps of: forming a via plug(301) standing on a conductive layer(302) which forms a shield for shielding a radio communication module(200), and forming a wiring structure(300) by filling the via plug in a dielectric layer(304); and bonding the wiring structure above a wiring substrate(100) where an electronic component which includes an active element(201) and an passive element(202-206) forming the radio communication module, are mounted.