发明名称 MULTI-LAYER CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
摘要 A multi-layer ceramic substrate and a method for manufacturing the same are provided to improve quality and reliability of the multi-layer ceramic substrate by removing fine crack, warpage, and separation phenomena by including a via bridge unit. A multi-layer ceramic substrate includes a ceramic substrate main body unit, at least one material layer(115), and at least one via bridge unit(119). The ceramic substrate main body unit is stacked with a plurality of ceramic layers(111,113) including first materials respectively. At least one material layer includes a second material different from the first material by being interposed between the plurality of ceramic layers. The via bridge unit includes a via hole(117) formed on at least one material layer and a material joined to the adjacent material layer and filled inside the via hole. The filling material of the via bridge unit has a larger junction strength than the strength of a material of the material layer to a material of the ceramic layers.
申请公布号 KR20080025968(A) 申请公布日期 2008.03.24
申请号 KR20060090808 申请日期 2006.09.19
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, TAEK JUNG;YOO, WON HEE
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
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