发明名称 |
MULTI-LAYER CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A multi-layer ceramic substrate and a method for manufacturing the same are provided to improve quality and reliability of the multi-layer ceramic substrate by removing fine crack, warpage, and separation phenomena by including a via bridge unit. A multi-layer ceramic substrate includes a ceramic substrate main body unit, at least one material layer(115), and at least one via bridge unit(119). The ceramic substrate main body unit is stacked with a plurality of ceramic layers(111,113) including first materials respectively. At least one material layer includes a second material different from the first material by being interposed between the plurality of ceramic layers. The via bridge unit includes a via hole(117) formed on at least one material layer and a material joined to the adjacent material layer and filled inside the via hole. The filling material of the via bridge unit has a larger junction strength than the strength of a material of the material layer to a material of the ceramic layers.
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申请公布号 |
KR20080025968(A) |
申请公布日期 |
2008.03.24 |
申请号 |
KR20060090808 |
申请日期 |
2006.09.19 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, TAEK JUNG;YOO, WON HEE |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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