CHIP EMBEDDED PRINT CIRCUIT BOARD AND FABRICATING METHOD THEREOF

摘要

A chip embedded printed circuit board and a fabricating method thereof are provided to stably treat the printed circuit board during a fabricating process by using a support layer of sufficient thickness to perform packaging in a very flat state. A fabricating method of a chip embedded printed circuit board includes the steps of: forming a first circuit pattern(115) on a top of a support layer; mounting a semiconductor chip(120) on the first circuit pattern; forming an insulation layer(130) on the top of the support layer to surround the first circuit pattern and the semiconductor chip and forming a metal layer on a top of the insulation layer; forming a via hole(150) passing through the insulation layer and the metal layer on the first circuit pattern and forming a plating layer(155) on an inner wall of the via hole; forming a second circuit pattern(145) on the top of the insulation layer by etching the metal layer; and forming a radiation plate(200) by removing the support layer in a region except a lower region of the semiconductor chip.