| 发明名称 |
METHOD FOR MANUFACTURING CIRCUIT DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve adhesion between an overcoat resin and a sealing resin layer by irradiating the overcoat resin formed on a conductive wiring layer with plasma. <P>SOLUTION: A first conductive film 23A and a second conductive film 23B which are laminated through an interlayer insulating layer 22 are formed. A first conductive wiring layer 12A is formed by selectively removing the first conductive film to cover the first conductive wiring layer with the overcoat resin 18. The surface is roughened by irradiating the overcoat resin 18 with the plasma. A sealing resin layer 17 is formed to cover the roughened surface of the overcoat resin 18 and a circuit element 13. <P>COPYRIGHT: (C)2008,JPO&INPIT |
| 申请公布号 |
JP2008066754(A) |
申请公布日期 |
2008.03.21 |
| 申请号 |
JP20070303187 |
申请日期 |
2007.11.22 |
| 申请人 |
SANYO ELECTRIC CO LTD;KANTO SANYO SEMICONDUCTORS CO LTD |
发明人 |
USUI RYOSUKE;MIZUHARA HIDEKI;IGARASHI YUUSUKE;SAKAMOTO NORIAKI |
| 分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
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