发明名称 DIAMOND-COVERED SUBSTRATE, ELECTRODE AND METHOD FOR ELECTROCHEMICAL TREATMENT, AND MANUFACTURING METHOD OF DIAMOND-COVERED SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a substrate which can be used as a substrate and can solve problems that the substrate itself is corroded during an electrochemical oxidation treatment, or the electrolysis cannot be continued by separating a diamond layer from the substrate, or the electrolytic efficiency is considerably degraded, and an electrode. SOLUTION: A diamond-covered substrate comprises a substrate and a conductive diamond layer covering the substrate, and the maximum area of a continuous portion of the diamond film constituting the diamond layer is≥1μm<SP>2</SP>and≤100 mm<SP>2</SP>. In particular, the thickness of the diamond layer is preferably 3-100μm, and roughness Ra of the surface of the substrate is≥0.1μm. In particular, the material of the substrate covered by the conductive diamond layer is any one of Nb, Ta, Zr and W. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008063607(A) 申请公布日期 2008.03.21
申请号 JP20060241172 申请日期 2006.09.06
申请人 SUMITOMO ELECTRIC IND LTD 发明人 SEKI YUICHIRO;IZUMI KENJI;IMAI TAKAHIRO
分类号 C23C16/27;C02F1/461;C23C8/12;C23C16/04;C25B11/10;C30B29/04 主分类号 C23C16/27
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