发明名称 PLASMA TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment device in which degree of plasma treatment to a work can be changed without exchanging an electrode. <P>SOLUTION: The plasma treatment device 1 is one in which a treated face 101 of the work 10 is treated by the plasma, and which includes a pair of electrodes 2, 3 installed mutually oppositely via the work 10, a power source circuit 7 equipped with the power source 72 that impresses voltage between the pair of electrodes 2, 3, a gas supply means 8 that supplies a treatment gas in order to form plasma between the pair of electrodes 2, 3, a nozzle 5 that ejects the treatment gas between the pair of electrodes 2, 3, and an angle adjustment means 9 that adjusts the angle formed by one electrode and the other electrode out of the pair of electrodes 2, 3 so as to locally change the distance between electrodes of the pair of electrodes 2, 3 when necessary. The treatment gas is activated to form the plasma by impressing voltage between the pair of electrodes 2, 3 while supplying the treatment gas so that the treated face 101 of the work 10 is treated by the plasma. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008066135(A) 申请公布日期 2008.03.21
申请号 JP20060243253 申请日期 2006.09.07
申请人 SEIKO EPSON CORP 发明人 GOMI KAZUHIRO
分类号 H05H1/24;H01L21/3065 主分类号 H05H1/24
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