| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus and a semiconductor manufacturing method which uniformly forms a film even to an end of a wafer. SOLUTION: The semiconductor manufacturing apparatus is provided with: a reaction chamber 2 introducing a wafer 1 to be processed; gas supply means 3 for supplying a reaction gas into the reaction chamber from the upper part of the reaction chamber; gas exhaust means 4 for exhausting the reaction gas from the reaction chamber; pressure control mechanisms 6a, 6b for controlling pressure in the reaction chamber; holder 8 for holding the wafer 1 to be processed at its external circumferential portion; heaters 9a, 9b for heating the wafer 1 to be processed from the upper part; and circular flow aligning fin 10 provided so that its upper end is positioned on the upper part of the holder 8 and its lower end is positioned on the lower part of the top surface of the holder 8, and provided with the lower end having a diameter larger than that of the upper end. COPYRIGHT: (C)2008,JPO&INPIT
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