发明名称 POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition capable of forming a resist pattern in which line edge roughness (LER) is reduced and a resist pattern forming method. <P>SOLUTION: The positive resist composition comprises a resin component (A) of which the alkali solubility increases under the action of an acid and an acid generator component (B) which generates an acid upon exposure to light, wherein the resin component (A) comprises a unit having a bridged alicyclic group in a side chain through an acetal bond and a unit having a tertiary ester type acid-dissociable group. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008065282(A) 申请公布日期 2008.03.21
申请号 JP20060246131 申请日期 2006.09.11
申请人 TOKYO OHKA KOGYO CO LTD 发明人 KINOSHITA YOHEI;IWAI TAKESHI;OGATA TOSHIYUKI
分类号 G03F7/039;G03F7/004;H01L21/027 主分类号 G03F7/039
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