| 摘要 |
<P>PROBLEM TO BE SOLVED: To miniaturize a semiconductor device having a structure in which a semiconductor element is sealed. <P>SOLUTION: The semiconductor device has: a silicon substrate; an element housing space including a concave portion formed on the silicon substrate and a hole penetrating through the bottom surface of the concave portion; a plurality of laminated semiconductor elements housed in the element housing space; a first lid for lidding the concave portion and a second lid for lidding the hole, which seal the semiconductor elements; and via plugs connected to any one of the semiconductor elements, which penetrate the bottom surface of the concave portion. <P>COPYRIGHT: (C)2008,JPO&INPIT |
