| 摘要 |
PROBLEM TO BE SOLVED: To lower an amount of metal remains derived from etching liquid, increase electric resistance value between wirings, and prevent migration, etc. SOLUTION: A printed-wiring board comprises a metal base layer and a conductive metal layer formed on at least one surface of an insulating film and a wiring pattern formed by selectively etching these layers through a plurality of etching processes, wherein an amount of metal remains derived from etching liquid on the printed-wiring board is≤0.05μg/cm<SP>2</SP>. COPYRIGHT: (C)2008,JPO&INPIT
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