发明名称 METHOD OF MANUFACTURING EPITAXIAL WAFER FOR SEMICONDUCTOR DEVICE, AND EPITAXIAL WAFER FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an epitaxial wafer for a semiconductor device capable of forming an LD with very stable optical characteristics such as a vertical radiation angle and with less variation by enabling high precision structural design and accurate feedback to its growing condition. SOLUTION: In the method of manufacturing the epitaxial wafer for the semiconductor device formed by growing a plurality of epitaxial layers on a substrate, a depthwise profile of Al composition in a plurality of epitaxial layers previously formed is directly estimated by a secondary ion mass analysis method. On the basis of depthwise profile data of the estimated Al composition the epitaxial layer is grown so as for the Al composition to provide a predetermined profile. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008066575(A) 申请公布日期 2008.03.21
申请号 JP20060244160 申请日期 2006.09.08
申请人 HITACHI CABLE LTD 发明人 SUZUKI RYOJI
分类号 H01L21/205;H01S5/323 主分类号 H01L21/205
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