| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform stable plasma treatment to a substrate by stabilizing plasma in a treatment vessel, when treating the substrate by applying high-frequency power and a DC voltage to identical or separate electrodes. <P>SOLUTION: A plasma treatment apparatus 1 comprises: a high-frequency power supply 16 for applying high-frequency power to at least one of electrodes 5, 6; a DC power supply 22 for applying a DC voltage to at least one of the electrodes 5, 6; a matching circuit 15 provided between the electrode 5 to which high-frequency power is applied, and the high-frequency power supply 16; and a control unit 25 for controlling the high-frequency power supply 16 so that the high-frequency power applied to the electrode is adjusted in advance at timing when the application of a DC voltage to the electrode 5 by the DC power supply 22 is started or completed while high-frequency power is applied to the electrode 5 by the high-frequency power supply 16. <P>COPYRIGHT: (C)2008,JPO&INPIT |
