| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable composition excellent in storage stability, formable into a one-component, and giving an excellent cured film which fully satisfies properties such as cracking resistance, electric insulation, PCT (pressure cooker test) resistance, adhesion, resistance to the heat of soldering, chemical resistance and resistance to electroless gold plating. <P>SOLUTION: The curable composition comprises (A) an epoxy resin having a 1,3-dioxolane ring obtained by performing a partial addition reaction of a ketone to an epoxy resin having two or more epoxy groups per molecule, (B) an acid, (C) a ketone-type solvent, (D) a carboxyl group-containing compound, (E) a photosensitive (meth)acrylate compound and (F) a photopolymerization initiator. When a carboxyl group-containing photosensitive compound is used as the component (D), the component (E), i.e., a photosensitive (meth)acrylate compound can be eliminated. The curable composition may be in a liquid form or in the form of a so-called dry film. <P>COPYRIGHT: (C)2008,JPO&INPIT |
