| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component packaging system and an electronic component packaging method in which packaging quality can be ensured in case of a such a substrate as the amount of solder is deficient owing to poor printing. <P>SOLUTION: In a packaging system comprising a device for measuring the height of solder paste printed on an electrode and an electronic component mounting device, a decision is made whether the height of a solder paste is correct or not based on the measurement of the height of solder paste printed on the electrode, a decision is further made whether transfer of solder paste to the solder bump is required or not based on the judgment results, and the paste is transferred to an electronic component held on a mounting head if it is required. Consequently, a proper amount of solder is added in case of such a substrate as the amount of solder is deficient owing to poor printing, and packaging quality can be ensured. <P>COPYRIGHT: (C)2008,JPO&INPIT |
