| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To manufacture an electronic component having excellent reliability by forming an electrical-connection part on an electrode at with excellent accuracy. <P>SOLUTION: An electronic component manufacturing method has a first step in which a solder ball is installed on an electrode pad by using a mask with a hole corresponding to the electrode pad, and a second step in which the electrical-connection part is formed on the electrode pad by heating the solder ball. The mask has a deflection prevention structure which prevents the deflection of the mask while holding an interval between the mask and the electrode pad. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
