PIPING INSPECTION METHOD USING GUIDE WAVE AND PIPING INSPECTION DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a piping inspection method using a guide wave capable of more shortening the time required in inspection and capable of detecting the depth of a reduced wall thick part and the piping circumferential length of the reduced wall thick part. SOLUTION: The probes 1a-1d of an ultrasonic probe group 1 and the probes 2a-2d of an ultrasonic probe group 2 are arranged on the piping 7 in the circumference. The probes 1a-1d and 2a-2d transmit the guide wave 6 to the piping 7 and receive the reflected signals from the reduced wall thick part 7b. These reflected signals are inputted to a signal processor 5B through an A/D converter 4. The signal processor 5B is constituted so as to calculate the waveform of a plurality of the circumferential modes of the circumferential guide wave of the piping the area of the reduced wall thick part formed in the piping on the basis of the amplitude of the waveform of a zero-order circumferential mode, the circumferential length of the reduced wall thickness part and the area of the reduced wall thick part the depth of the reduced wall thick part on the basis of the area of the reduced wall thick part and the circumferential length. COPYRIGHT: (C)2008,JPO&INPIT