发明名称 NOVEL POLYIMIDE RESIN
摘要 PROBLEM TO BE SOLVED: To provide a polyimide resin that can be suitably used as a coating-forming material for coating an electronic material, especially a conductor circuit pattern and is excellent in the balance of physical properties. SOLUTION: The polyimide resin has a repeating unit consisting of three constitutional formulae of a constitutional formula containing a diphenylsulfone group, a constitutional formula containing a phenylcarbonyl group and a constitutional formula containing a phenylene group or a phenylene derivative group wherein the proportion of the repeating units having three constitutional formulae in the polyimide resin is in a specific range. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008063523(A) 申请公布日期 2008.03.21
申请号 JP20060245502 申请日期 2006.09.11
申请人 KANEKA CORP 发明人 FUJIWARA HIROSHI
分类号 C08G73/10;H05K3/28 主分类号 C08G73/10
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