发明名称 THERMOSENSITIVE ADHESIVE COMPOSITION AND THERMOSENSITIVE ADHESIVE MATERIAL USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thermosensitive adhesive composition having high blocking resistance and exhibiting adhesive force on various adherends from a mirror finished surface adherend such as a metal and a plastic to a rough surfaced adherend such as a corrugated cardboard, and to provide a thermosensitive adhesive materials having delayed tack type adhesion obtained by coating the composition on a support such as paper and a film. SOLUTION: A thermosensitive adhesive composition comprising at least a solid plasticizer and a thermoplastic resin which solid plasticizer comprises a compound represented by general formula (1), and the thermosensitive adhesive material using the composition are provided. (In the formula, R1, R2 and R3 are each a 1-8C alkyl). COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008063460(A) 申请公布日期 2008.03.21
申请号 JP20060243382 申请日期 2006.09.07
申请人 RICOH CO LTD 发明人 KUGO TOMOYUKI
分类号 C09J201/00;B32B27/00;C09J7/02;C09J11/06 主分类号 C09J201/00
代理机构 代理人
主权项
地址