BALL ARRAYING PLATE, BALL ARRAYING DEVICE, AND BALL ARRAYING METHOD

摘要

PROBLEM TO BE SOLVED: To improve an yield in a bump formation process, definitely array conductive balls by chucking to transfer them to a predetermined position, and form bumps at high productivity. SOLUTION: After the conductive balls 7 in a ball accommodating container 14 are arrayed by chucking, a recess 9 and a salient 8 are formed on the backside of the side that chucks the conductive balls 7 of the ball arraying plate used to mount the conductive balls 7 in batch on an object electrode on which they are to be mounted. COPYRIGHT: (C)2008,JPO&INPIT