| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition giving cured products causing no defective appearance due to the ooze of a mold-releasing agent and excellent in continuously moldable property, and to provide a semiconductor device sealed with a cured product of the resin composition. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a phenol resin curing agent, (C) an inorganic filler of 400-1,200 pts.mass based on 100 pts.mass total of the (A) and (B) ingredients, (D) a curing accelerator of 0.1-5 pts.mass based on 100 pts.mass total of the (A) and (B) ingredients, and (E) a capsule type mold-releasing agent including or supporting a mold-releasing compound in or on porous inorganic particulate of 0.1-10 pts.mass based on 100 pts.mass total of the (A) and (B) ingredients, and semiconductor devices sealed with a cured product of the epoxy resin composition are provided. COPYRIGHT: (C)2008,JPO&INPIT
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