发明名称 |
LENS MOLD FOR LED PACKAGE, AND METHOD FOR MANUFACTURING LED PACKAGE USING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mold made from a fluororesin and a method for manufacturing an LED package using the mold so that a resin used as a lens material does not stick even by using no additional deformed film. <P>SOLUTION: This lens mold for LED package has cavities formed so that the resin acting as the material of the lens for the LED package fills them, which keeps the whole or a part including the inside surface of the cavities made from the fluororesin (Fluorocarbon resin), and constituted so that the resin filling the cavities do not adhere. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008066733(A) |
申请公布日期 |
2008.03.21 |
申请号 |
JP20070231388 |
申请日期 |
2007.09.06 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
PARK YOUNG SAM;HAHM HUN JOO;HAN SEONG YEON;YOO CHUL HEE |
分类号 |
H01L33/44;H01L33/54;H01L33/56 |
主分类号 |
H01L33/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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