发明名称 YIELD PREDICTIVE SYSTEM AND METHOD FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To calculate the average fatality of a yield prediction subject product from the type feature quantity of the subject product to precisely predict yield during manufacturing of the yield prediction subject product. SOLUTION: The monthly fatal defect density of a reference product that is different in wiring pattern from, but identical in manufacturing process with the prediction subject product is calculated from measured data. The average fatality of the prediction subject product and of the reference product are calculated from the type feature quantity of the prediction subject product and of the reference product. The monthly fatal defect density of the reference product is multiplied by a calculated average fatality ratio to calculate the monthly fatal defect density of the yield prediction subject product. A yield is calculated using a monthly fatal defect density in the period when a yield prediction subject lot of prediction subject products is processed. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008066711(A) 申请公布日期 2008.03.21
申请号 JP20070175578 申请日期 2007.07.03
申请人 HITACHI LTD 发明人 MORIOKA NATSUYO;IKEGAYA KATSUMI;YAMAGUCHI YASUNORI;ITO KAZUO;ISHIKAWA SEIJI;HAMAMURA YUICHI
分类号 H01L21/66 主分类号 H01L21/66
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