发明名称 |
MOLDING STAMPER AND MOLDING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a molding stamper with large thermal efficiency and a molding apparatus. SOLUTION: In the molding stamper for molding a molding material 12, a heating resistor 20 is installed in a substrate 19 with its main surface part 21 rugged. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2008062484(A) |
申请公布日期 |
2008.03.21 |
申请号 |
JP20060242182 |
申请日期 |
2006.09.06 |
申请人 |
KYOCERA CORP;KYOTO UNIV |
发明人 |
FURUKUWA TAKESHI;MATSUDA SHIN;KODERA HIDETOSHI |
分类号 |
B29C33/02;B29C33/42;B29C43/36;B29C59/02;G11B7/26;H01L21/027 |
主分类号 |
B29C33/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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