| 摘要 |
PROBLEM TO BE SOLVED: To provide a flux for soldering and a solder paste composition capable of demonstrating excellent wettability to a metal or a plating containing no lead irrespective of the kind of the metal. SOLUTION: The flux for soldering contains a base resin and an activator. The activator contains an oxygen-containing heterocyclic compound having at least one carboxylic group in a molecule. The oxygen-containing heterocyclic compound preferably has a five-membered ring structure to be selected from a group consisting of furan, hydrofuran, and oxazole. The content of the oxygen-containing heterocyclic compound is preferably 0.1-50 wt.% to the total flux. The solder paste composition contains the flux and solder alloy powder. COPYRIGHT: (C)2008,JPO&INPIT
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