| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an AlN sintered compact which has high denseness and practical thermal conductivity and has improved fracture toughness values compared with conventional AlN sintered compacts. <P>SOLUTION: The aluminum nitride sintered compact comprises a spherical holmium aluminate phase dispersed in the sintered compact. It is particularly preferred that the holmium aluminate phase has a Ho<SB>3</SB>Al<SB>5</SB>O<SB>12</SB>structure. <P>COPYRIGHT: (C)2008,JPO&INPIT |
