| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent a pad from being peeled off upon wire bonding by preventing cracking in an insulating film on a lower layer of the pad during probing for inspection or during wire bonding, and also to provide a method of manufacturing the semiconductor device. <P>SOLUTION: The semiconductor device includes one insulating film 112 formed on a semiconductor substrate 101, one metallic pattern 116 formed on the insulating film 112, another insulating film 117 formed on the insulating film 112 and the metallic pattern 116, another metallic pattern 119 formed on the insulating film 117 to be opposed to the metallic pattern 116, and connection holes 120b made in the insulating film 117 to be arranged in the periphery of the metallic pattern 119. The metallic patterns 116 and 119 are directly contacted with each other via the connection holes 120b to be electrically connected to each other. <P>COPYRIGHT: (C)2008,JPO&INPIT |
