| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To form two patterns of wiring and a via hole using a mask in common when manufacturing a multilayer wiring structure in which a via hole is formed right under the wiring. <P>SOLUTION: A mask 100 is configured in such a manner that transmittance of a wiring pattern 2 formed on the mask 100 is made different from that of a via hole pattern 3 disposed right under the wiring pattern 2. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
