| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate positioning method, a substrate position detecting method and a substrate collecting method for detecting a position of the substrate, positioning the substrate, and collecting the substrate without any damage on the substrate not only in the case where the circumferential edge of the substrate can be detected but also the substrate is displaced as much as disabling detection of the circumferential edge of the substrate. <P>SOLUTION: The circumferential edges of wafer as the objects are respectively detected (step S210) on the basis of output images from a plurality of imaging means arranged along the shape of the circumferential edge of the wafer and correction (step S220) of displacement of the wafer and rough correction thereof (step S230) are conducted in accordance with the number of imaging means having detected the circumferential edges of wafer. If the circumferential edge of wafer cannot be detected with all imaging means, wafer position adjustment (step S240) is conducted by moving the wafer in the position adjusting direction attained by combination of output images obtained from each imaging means. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
