| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring pattern which has little protuberance at an angular part of a conductive pattern, and a good insulating characteristic even in the case of a laminating wiring structure through an insulating layer, and to provide an electronic element using it and the like. SOLUTION: An energy is applied to a wettability change layer 2 to form a high surface energy part 3 and a conductive pattern 5 is formed thereon with a conductive liquid to form a wiring pattern 1. At that time, a shape in plan view of the conductive pattern is a rectangular wiring shape in which the angular part is chamfered, and the shape in sectional view is a substantially flat shape as a whole which has little protuberance at the angular part, and in which the angular part is contiguous to a pattern central part smoothly. A laminating wiring pattern and a laminating wiring substrate are constituted by using the wiring pattern 1. Alternatively, a semiconductor layer is formed so as to come into contact with a low surface energy part of the wettability change layer 2 and an electronic element and an organic semiconductor element are constituted. COPYRIGHT: (C)2008,JPO&INPIT
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