| 摘要 |
<P>PROBLEM TO BE SOLVED: To apply a die attach paste to a wafer in a short time, without the use of a die attach film. <P>SOLUTION: A wafer processor (10) includes a grinding means (80) which grinds the rear surface (22) of a wafer (20) where a circuit pattern (C) is formed on its surface (21), and a die attach paste application means (30), which applies a die attach paste to the entire rear surface of the wafer that has been ground by the grinding means. The die attach paste application means is a spin-coating means (30A) for spin-coating the die attach paste supplied to the rear surface of the wafer, or a screen printing means (30B) which screen-prints the die attach paste on the rear surface of the wafer. <P>COPYRIGHT: (C)2008,JPO&INPIT |
