| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and an apparatus a method for splitting a rigid brittle plate without stain and thermal influence to an electronic circuit element formed on a substrate surface, in a splitting process of a large-sized semi-conductor wafer or glass substrate on which many semiconductor devices or liquid crystal panels being a plate of a brittle material are formed. <P>SOLUTION: In the method for splitting the brittle material plate by laser irradiation, a laser with a wave length which has permeability to the plate objected for splitting is used, a material absorbing the laser light is set in closely contact with the rear face of the material, and the laser ray is cast on the surface of the objected plate to be split. The rear side of the plate is heated by laser irradiation, and a temperature difference is caused between the surface and the rear face. As the result, a thermal stress is given, a crack as making an initial defect as a starting point as the basis of progresses is developed, then the objected plate is split. An influence of heat to the element can be inhibited because the temperature at the surface where the electronic circuit element is formed does not rise. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
