MULTI-CHIP PACKAGE EQUIPPED WITH INTER-CHIP HEAT TRANSFER SHIELDING SPACER

摘要

PROBLEM TO BE SOLVED: To provide a multi-chip package equipped with an inter-chip heat transfer shielding spacer.

SOLUTION: A multi-chip package 100 has: a semiconductor chip laminated structure having a first semiconductor chip 112 with a first function and a second semiconductor chip 114 with a second function, both mounted on a printed-circuit substrate 100 such that they face each other; and a heat transfer shielding spacer 120 between the first and second semiconductor chips 112 and 114. This structure shields heat transfer from one semiconductor chip having comparatively large power consumption of the two mutually adjacent semiconductor chips to the other one having comparatively low power consumption, thus reducing Tj at the chip having relatively low power consumption to prevent characteristic degradation by heat.

COPYRIGHT: (C)2008,JPO&INPIT