| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin composition that has excellent flowability, curability, mold releasability, and continuous moldability, and also hardly makes the surface of molded resin product and a mold dirty in time of sealing molding work even when an amount of compounded inorganic filler is increased. SOLUTION: The semiconductor-sealing epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, (D) a curing accelerator, and (E) a tolylene diisocyanate-modified oxidized wax, wherein, the curing accelerator (D) contains a curing accelerator (d1) having a cationic part and a silicate anion part. COPYRIGHT: (C)2008,JPO&INPIT |
