发明名称 POWER SUPPLY WIRING STRUCTURE IN SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a power supply wiring structure in a semiconductor integrated circuit for assuring signal wirings in the second direction of an intermediate wiring layer without lowering of performance to supply the drive power up to a function circuit. SOLUTION: A power supply wiring D3 of intermediate layer is located within a wiring region of the power supply wiring D4 of the highest layer, extended to an external part of a wiring region of the power supply wiring D1 of the lowest layer in the second direction Y, and via-connected to the power supply wiring D4 of the highest layer. At a crossing region K1 of the power supply wiring D1 of the lowest layer and the power supply wiring D4 of the highest layer, a power supply wiring D2 of the second layer includes a part located at the upper part of the power supply wiring D1 of the lowest layer and a part located at the lower part of the power supply wiring D3 of the intermediate layer, is via-connected to the power supply wiring D1 of the lowest layer and the power supply wiring D3 of the intermediate layer, and a wiring region of the signal wiring R3 that may be wired along the second direction in the intermediate wiring layer is acquired within the crossing region K1. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008066371(A) 申请公布日期 2008.03.21
申请号 JP20060240010 申请日期 2006.09.05
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SHIMIZU TADAHIRO
分类号 H01L21/82;H01L21/3205;H01L21/768;H01L21/822;H01L23/52;H01L23/522;H01L27/04 主分类号 H01L21/82
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