发明名称 TRANSPARENT MATERIAL PROCESSING WITH ULTRASHORT PULSE LASER
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for scribing or welding transparent materials. <P>SOLUTION: A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008062263(A) 申请公布日期 2008.03.21
申请号 JP20060241654 申请日期 2006.09.06
申请人 IMRA AMERICA INC 发明人 BOVATSEK JAMES MICHAEL;ARAI ALAN Y;YOSHINO FUMIYO
分类号 B23K26/00;B23K26/32;B29C65/16;C03B23/20;C03B33/09;C04B41/91 主分类号 B23K26/00
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