发明名称 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To solve the problem of a performance improving technique in microfabrication of a semiconductor element using a high-energy ray, particularly KrF excimer laser light, an electron beam, an X-ray or EUV light, and to provide a positive resist composition excellent in line edge roughness, pattern profile, sensitivity, dissolution contrast, contrast, outgassing in exposure and PEB temperature dependency, and to provide a pattern forming method using the same. <P>SOLUTION: The positive resist composition comprises (A) a polymer having three or more polymer chains through at least one branch part and having solubility in an alkali developer increased by the action of an acid and (B) a specific sulfonium salt as a compound capable of generating an acid upon irradiation with an actinic ray or radiation. The pattern forming method using the same is also provided. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008065266(A) 申请公布日期 2008.03.21
申请号 JP20060245933 申请日期 2006.09.11
申请人 FUJIFILM CORP 发明人 HIRANO SHUJI;KAWANISHI YASUHIRO;WADA KENJI
分类号 G03F7/033;G03F7/004;G03F7/039;H01L21/027 主分类号 G03F7/033
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