发明名称 LIQUID PHENOLIC RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a liquid phenolic resin composition forming a molded product having excellent properties inherent in a phenolic resin such as heat resistance and curability, and also excellent in flexibility. SOLUTION: The liquid phenolic resin composition contains a resol-type phenolic resin and a polyamide resin, wherein the polyamide resin is preferably a methoxymethylated polyamide resin, and its weight proportion is preferably 2-50 wt.% based on the total solids in the composition. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008063441(A) 申请公布日期 2008.03.21
申请号 JP20060242780 申请日期 2006.09.07
申请人 SUMITOMO BAKELITE CO LTD 发明人 IMAI JUNJI
分类号 C08L61/06;C08J5/14;C08L77/00;C09K3/14;F16D13/62;F16D69/02 主分类号 C08L61/06
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