发明名称 AUDIO DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an audio device in which trouble due to temperature rise of an electronic circuit stored inside a main body part is prevented and the main body part is easily miniaturized. SOLUTION: A radiation fin part 2 in which approximate tabular radiation fins 3<SB>1</SB>, 3<SB>2</SB>, ..., 3<SB>m</SB>are arranged approximately like comb shape is provided at a part of the approximate box-shaped main body part. The radiation fin part 2 is provided with a contact surface in a third substrate part in which an output amplifier circuit with much calorific value by nature is formed is installed at a state that the contact surface comes in contact with the radiation fin part 2. Since heat generated by the output amplifier circuit with much calorific value by nature is transmitted to the radiation fins and emitted into the air, the heat of a board part can be emitted with high efficiency. A first amplifier part and a second amplifier part of an output amplification part are BTL connected to speakers 8<SB>1</SB>, 8<SB>2</SB>, ..., 8<SB>n</SB>and the calorific value of the output amplification part is reduced by raising output efficiency. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008060965(A) 申请公布日期 2008.03.13
申请号 JP20060236092 申请日期 2006.08.31
申请人 ANODEIKKU SUPPLY:KK 发明人 ISHIKAWA MASAKAZU;FUJITA TAKESHI;FURUKAWA YOSHIHIRO
分类号 H04R1/00;H03F1/30 主分类号 H04R1/00
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