| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid processing apparatus and a liquid processing method for surely preventing adhesion of particles to a substrate when it is dried, and also preventing generation a water mark without increase in the initial cost and running cost and without increase in foot print. SOLUTION: The liquid processing apparatus 100 conducts a liquid process to a substrate while the processing liquid is supplied to a wafer W, and conducts thereafter the drying process. This liquid processing apparatus 100 includes a substrate holder 2 for horizontally holding the wafer W to be rotatable, a rotating mechanism 3 for rotating the substrate holder 2, a processing liquid supplying mechanism 85 for supplying the processing liquid to the wafer W, and a drying gas supplying mechanism 10 for supplying the drying gas at least to the circumferential edge at the upper part of the wafer W during the process for drying the wafer W. COPYRIGHT: (C)2008,JPO&INPIT
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