发明名称 MOUNTING STRUCTURE OF LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a mounting structure of laminated ceramic electronic component for effectively increasing a surge resistance voltage and preventing easier breakdown of electronic component at the time of electrostatic discharge. SOLUTION: A laminated ceramic electronic component 6 is mounted on a mounting surface 2a of a printed circuit board 2 in the mounting structure 1 of laminated ceramic electronic component. External electrodes 14, 15 of the laminated ceramic electronic component 6 are bonded to the first and second land electrodes 3, 4 provided on the mounting surface 2a with conductive bonding agents 16, 17. An earth conductor 5 having the thickness t<SB>2</SB>is expressed by t<SB>1</SB><t<SB>2</SB>≤d<SB>1</SB>, when distance is defined as d<SB>1</SB>between a lower surface 7b as a second principal surface opposing to the mounting surface 2a of the ceramic laminated material 7 and the mounting surface 2a, and thickness of the land electrodes 3, 4 is defined as t<SB>1</SB>. The mounting structure is formed between the first and second land electrodes 3, 4 on the mounting surface 2a of the printed circuit board 2. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008060214(A) 申请公布日期 2008.03.13
申请号 JP20060233417 申请日期 2006.08.30
申请人 MURATA MFG CO LTD 发明人 KAWAHARA TOSHINORI;SHIMIZU NAOKI
分类号 H01G4/252;H01G4/12;H01G4/30 主分类号 H01G4/252
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