| 摘要 |
PROBLEM TO BE SOLVED: To provide a base material for mounting electronic components capable of ensuring the shape of a metal wiring, and to provide a manufacturing method thereof. SOLUTION: The base material for mounting an electronic component 100 has a constitution in which a solder resist 5 and a metal coating 6, having higher bondability for the electronic component to be mounted than that of a metal wiring 4 are formed on the metal wiring 4 formed on a resin film 1. The solder resist 5 and the metal coating 6 are formed on different regions, on the metal wiring 4, protective films 7a, 7b having higher bondability with the metal wiring 4 than that of the solder resist 5 are formed on a portion P1 opposite to a region forming the metal coating in the edge portion in the region of forming the solder resist 5, and the protective films 7a, 7b and the solder resist 5 are stacked on the metal wiring 4, in this order. COPYRIGHT: (C)2008,JPO&INPIT
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