| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition useful for an insulation material (highly reliable semiconductor sealing material or the like) or the like for electric or electronic components because of the suppressed precipitation of a crystal, excellent operability at production and excellent quality control. SOLUTION: The epoxy resin composition contains (a) an epoxy resin obtained by reacting a phenol resin represented by formula (1) (wherein, n is a repetition number and an integer of 1-20), and obtained by reacting 4,4'-bischloromethylbiphenyl with phenol in the presence of a basic material, and is regulated so that the total molar number (o-coordination number) of benzene rings to which the methylene group is bonded at the o-position based on the hydroxy group, and the total molar number (p-coordination number) of benzene rings to which the methylene group is bonded at the p-position based on the hydroxy group may satisfy the relation of (o-coordination number)/(p-coordination number)≥1.5×V+1.2 (V is the melt viscosity at 150°C, and the unit is Pa×s), with an epihalohydrin, (b) a curing agent and (c) a solvent. COPYRIGHT: (C)2008,JPO&INPIT
|
