发明名称 GRINDING METHOD AND GRINDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a grinding method and a grinding device capable of carrying out profile-grinding at a favorable yield rate and suppressing a load on a grinding tool to the minimum. SOLUTION: A workpiece 1 is carried on a specified circumferential track by a rotating drive mechanism (rotating arm 2 and holding mechanism 3), and the workpiece 1 carried by the profile-grinding grinding tool 4 arranged to face against the circumferential track rotating direction on the circumferential track is profile-ground in a specified shape. The workpiece 1 carried on the circumferential track passes in the tangential direction with respect to the profile-grinding grinding tool 4, and profile-grinding by the profile-grinding grinding tool 4 is carried out on its head end surface (surface outward in the diametrical direction of the circumferential track). COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008055547(A) 申请公布日期 2008.03.13
申请号 JP20060235089 申请日期 2006.08.31
申请人 TDK CORP 发明人 AKIBA KENJI;YANAGA HIROSHI
分类号 B24B7/22;B24B19/26;B24B41/06 主分类号 B24B7/22
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