| 摘要 |
An integrated circuit includes a metallization layer, a first metal line in the metallization layer, and a first via electrically connected to the first metal line. The first via has a first via width and a first pitch from a nearest via on a neighboring metal line, wherein the first pitch is a minimum pitch of all vias on the metallization layer. The integrated circuit further includes a second metal line in the metallization layer, and a second via electrically connected to the second metal line. The second via has a second pitch greater than about 1.1 times the first pitch. The second via has a second via width greater than the first via width but no more than about 1.4 times the first via width.
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